| 摘要 |
PURPOSE:To form a software developing socket used for developing an ASIC microcomputer into the same lead shape as that of a completed IC package at a low cost. CONSTITUTION:A software developing socket is constituted of leads 11 connected to a board 14 to be mounted, connecting pins 12 connected to an external device 15, and a package 13 arranged with the leads 11 and the connecting pins 12. The leads 11 are formed into a lead frame structure, the connecting pins 12 and the leads 11 are electrically connected, the package 13 is made of resin, and the leads 11 and the connecting pins 12 are resin-sealed and fixed. |
