发明名称 VERFAHREN ZUR ELEKTRISCHEN VERBINDUNG VON LEITUNGEN UND ELEKTRODEN EINER IMPLANTIERBAREN ELEKTRODENLEITUNG.
摘要 A conductor 21 embedded in the insulating layers 3, 4 of an implantable lead l is connected to an electrode by arranging the conductor to be included as one pole in a high voltage circuit where the other pole is a needle 8 or the like placed in the vicinity of the conductor 21. The voltage is increased until an insulating layer puncturing flash-over between the conductor and the needle takes place. The flash-over arc is maintained to burn a hole l2 in the insulation layers 3, 4 so that the conductor can e.g. be brought out with a curved tool 9 to form a connecting end to be applied to the electrode.
申请公布号 DE3782051(T2) 申请公布日期 1993.03.25
申请号 DE19873782051T 申请日期 1987.05.27
申请人 SIEMENS AG, 8000 MUENCHEN, DE 发明人 HIRSCHBERG, JAKUB, S-183 44 TAEBY, SE
分类号 A61N1/05;H01R43/00;(IPC1-7):A61N1/05 主分类号 A61N1/05
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