发明名称 |
VERFAHREN ZUR ELEKTRISCHEN VERBINDUNG VON LEITUNGEN UND ELEKTRODEN EINER IMPLANTIERBAREN ELEKTRODENLEITUNG. |
摘要 |
A conductor 21 embedded in the insulating layers 3, 4 of an implantable lead l is connected to an electrode by arranging the conductor to be included as one pole in a high voltage circuit where the other pole is a needle 8 or the like placed in the vicinity of the conductor 21. The voltage is increased until an insulating layer puncturing flash-over between the conductor and the needle takes place. The flash-over arc is maintained to burn a hole l2 in the insulation layers 3, 4 so that the conductor can e.g. be brought out with a curved tool 9 to form a connecting end to be applied to the electrode. |
申请公布号 |
DE3782051(T2) |
申请公布日期 |
1993.03.25 |
申请号 |
DE19873782051T |
申请日期 |
1987.05.27 |
申请人 |
SIEMENS AG, 8000 MUENCHEN, DE |
发明人 |
HIRSCHBERG, JAKUB, S-183 44 TAEBY, SE |
分类号 |
A61N1/05;H01R43/00;(IPC1-7):A61N1/05 |
主分类号 |
A61N1/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|