VERFAHREN ZUR OPTIMIERUNG DES SCHWEISSPROZESSES BEI BONDVERFAHREN

摘要

A process for optimizing soldering allows bondings (USB, TSB, TCB, SPTAB or others, including macro-solderings) to be obtained having a high and constant quality. According to this process, the ultrasonic vibration curve during soldering is recorded and evaluated. The results from the evaluation are used to control the soldering parameters so as to optimize them and to control the quality of the bonds. The number of troughs and peaks of the mechanical amplitude curve envelope during soldering, as well as their spacing in time, are used for the optimizing control. A process control quantity for individually dosing the process energy required for each bonding is derived from unsteady conditions of vibration after dosed acoustic energy jumps. The harmonic content of the ultrasonic vibrations at the bonding tool is used for non-destructively controlling the quality of each bonding site.