发明名称 Flexible printed substrate.
摘要 A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer. <IMAGE>
申请公布号 EP0533198(A2) 申请公布日期 1993.03.24
申请号 EP19920116025 申请日期 1992.09.18
申请人 NITTO DENKO CORPORATION 发明人 HINO, ATSUSHI;MOCHIZUKI, AMANE;OUCHI, KAZUO;MORITA, SHOJI;NAITO, TOSHIKI;HIGASHI, KAZUMI;MAEDA, MASAKO;KANETO, MASAYUKI;TANAKA, MUNEKAZU;SUGIMOTO, MASAKAZU
分类号 H05K1/00;H05K1/03;H05K3/00;H05K3/20;H05K3/28;H05K3/40;H05K3/42;H05K3/46 主分类号 H05K1/00
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