发明名称 |
Flexible printed substrate. |
摘要 |
A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer. <IMAGE> |
申请公布号 |
EP0533198(A2) |
申请公布日期 |
1993.03.24 |
申请号 |
EP19920116025 |
申请日期 |
1992.09.18 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
HINO, ATSUSHI;MOCHIZUKI, AMANE;OUCHI, KAZUO;MORITA, SHOJI;NAITO, TOSHIKI;HIGASHI, KAZUMI;MAEDA, MASAKO;KANETO, MASAYUKI;TANAKA, MUNEKAZU;SUGIMOTO, MASAKAZU |
分类号 |
H05K1/00;H05K1/03;H05K3/00;H05K3/20;H05K3/28;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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