| 摘要 |
A reflow system for heating solders temporarily attaching electronic components to a circuit board, includes an elongated heating chamber in which a conveyor extending from an inlet to an outlet of the heating chamber, at least one first heating unit, a fan unit and an organic substance decomposition unit are disposed. The conveyor, first heater unit and fan unit are arranged to circulate gas in the heating chamber along a circulation path such that the gas is first heated by the first heater unit, then forced by the fan against the conveyor, and thereafter heated again by the first heater unit. The organic substance decomposition unit is disposed in the circulation path. The solders are heated by hot air. It is possible to heat the solder with hot nitrogen gas in which instance a nitrogen gas supply unit disposed outside the heating chamber is used to fill the heating chamber with nitrogen gas.
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