发明名称 |
Method of manufacturing semiconductor device with controlled carrier lifetime |
摘要 |
A semiconductor device has a semiconductor substrate, an insulated gate field-effect transistor section formed in the substrate and a peripheral section formed in the substrate and arranged to substantially surround the field-effect transistor section. A passivation layer of an organic material is provided over that part of the substrate in which the field-effect transistor section is not located. The device may be resin mold packaged for an enhanced humidity-resistance by making use of the fact tht the peripheral portion of the device is covered with organic resin.
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申请公布号 |
US5196354(A) |
申请公布日期 |
1993.03.23 |
申请号 |
US19900582583 |
申请日期 |
1990.09.14 |
申请人 |
HITACHI, LTD. |
发明人 |
OHTAKA, SHIGEO;ANDOO, AKIO;IIJIMA, TETSUO |
分类号 |
H01L21/312;H01L21/263;H01L21/336;H01L23/29;H01L29/06;H01L29/40;H01L29/78 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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