发明名称 Method of manufacturing semiconductor device with controlled carrier lifetime
摘要 A semiconductor device has a semiconductor substrate, an insulated gate field-effect transistor section formed in the substrate and a peripheral section formed in the substrate and arranged to substantially surround the field-effect transistor section. A passivation layer of an organic material is provided over that part of the substrate in which the field-effect transistor section is not located. The device may be resin mold packaged for an enhanced humidity-resistance by making use of the fact tht the peripheral portion of the device is covered with organic resin.
申请公布号 US5196354(A) 申请公布日期 1993.03.23
申请号 US19900582583 申请日期 1990.09.14
申请人 HITACHI, LTD. 发明人 OHTAKA, SHIGEO;ANDOO, AKIO;IIJIMA, TETSUO
分类号 H01L21/312;H01L21/263;H01L21/336;H01L23/29;H01L29/06;H01L29/40;H01L29/78 主分类号 H01L21/312
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