| 摘要 |
PURPOSE:To provide a pressure-grinding device, which can measure pressurized pressure and surface temperature of a board at the time of pressure-grinding a wafer substrate. CONSTITUTION:A pressure sensor 11 and/or a temperature sensor 12 are/is arranged near the adhesion surface of a wafer substrate 3 of a rotary top ring 2, and a light transmitter 13 for converting electric signals from these sensors 11, 12 to light is fitted to the rotary top ring 2, and on the other hand, a light receiver 15 is arranged in a holder 16, which is fitted to a holding member 4, at a position opposite to the light transmitter 13 to receive the optical signal from the light transmitter 13 and convert it to an electric signal. Pressurized pressure and surface temperature of the wafer substrate 3 during the rotary grinding by a grinding level plate 1 can be thereby measured intermittently. |
