| 摘要 |
A carrier for a semiconductor wafer or other substrate has an outer portion adapted for engagement by equipment for processing wafers. Interior to the outer portion a substantially planar supporting surface is provided. A retaining lip is provided above the plane in which the supporting surface lies by at least the height of a wafer of a selected size. The circumference of the retaining lip is of sufficient size and proper shape to permit the passage of a wafer of the selected size. The carrier is undercut under the lip, whereby a wafer of the selected size, when placed on the supporting surface, may be retained. In one embodiment, the carrier has a cylindrical shape. The top of the carrier includes a flat outer ring-like surface. The supporting surface and the circumference of the retaining lip are both circular.
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