| 摘要 |
PURPOSE:To prevent that a sheduling mistake or the setting mistake of a wafer is caused, to eliminate a sheduling treatment and to perform an exposure treatment by distinguishing the kind of the wafer only by setting the wafer on an apparatus. CONSTITUTION:The title method is constituted in the following manner: a mark 6 is put on a wafer 5 to be exposed; the wafer is set on an aligner 1; the mark is detected by using the aligner; exposure information corresponding to the mark is extracted from a registered database which has been read in a computer for exposure control use; and an exposure treatment is executed on the basis of the exposure information. |
