THERMOPLASTIC MOLDING MATERIALS BASED ON POLYAMIDE MIXTURES

摘要

- 28 - O.Z. 0050/42685 of the Disclosure: Thermoplastic molding materials comprise A) from 1 to 18% by weight of a partly aromatic copoly mer having a triamine content of below 0.5% by weight and composed of A1) from 20 to 90% by weight of units derived from terephthalic acid and hexamethylenediamine, A2) from 0 to 50% by weight of units derived from ?-caprolactam, A3) from 0 to 80% by weight of units derived from adipic acid and hexamethylenediamine, and A4) from 0 to 40% by weight of further polyamide forming monomers, the proportion of component (A2) or (A3) or (A4) or of a mixture thereof being at least 10% by weight, B) from 22 to 99% by weight of a partly crystalline polyamide other than A), C) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, and D) from 0 to 40% by weight of an elastomeric polymer.