| 摘要 |
PURPOSE:To provide a molded structure of an ethylene copolymer composition having good gas barrier properties, good pinhole resistance, and good thermal stability during molding and suitable as a packaging material. CONSTITUTION:The objective molded structure is made of a composition consisting of 55-80wt.% ethylene/unsaturated ester copolymer (A) having an unsaturated ester content of 15-35wt.% and a melt flow rate of 0.5-20g/10min at 190 deg.C under a load of 2160g and 45-20wt.% ethylene/vinyl alcohol copolymer (B) having a vinyl alcohol content of 50-80mol%, a melt flow rate of 0.5-30g/10min at 210 deg.C under a load of 2160g, and an apparent melt viscosity at 220 deg.C under a shear rate of 100sec<-1> lower than that of component A by 300-1000Pa.S and in which the component B forms uniformly dispersed thin layers. |
