| 摘要 |
PURPOSE:To enable a resin sealed-type semiconductor device to be enhanced in saturated thermal resistance property by a method wherein an active element is mounted on the surface of a ceramic board, and a sealing resin layer is made to coat so as to expose the surface of the ceramic board opposite to the surface where the active element is mounted. CONSTITUTION:A lead frame 1 whose surface is formed of copper or copper alloy is equipped with a bed and inner leads, and an active element is built in a semiconductor substrate 2 mounted on tone bed concerned. Prescribed impurities are introduced and diffused into a silicon substrate for the formation of the active element concerned. The semiconductor substrate 2 in which the active element is built is fixed to the lead frame 1 with a solder layer 3. Then, electrodes formed on the active element and the like are electrically connected with fine metal wires 5. Furthermore, the lead frame 1 is mounted on a ceramic substrate 7 with a low-melting Sn-Pb solder layer 8 to form an assembly of integral structure. Then, the assembly is sealed up With thermoplastic resin 6, where an outer lead 4 and the rear of the substrate 7 are exposed outside of the resin layer 6. By this setup, a resin-sealed type semiconductor of this design can be enhanced in saturated thermal resistance property. |
