发明名称 SINGLE WAFER ION BEAM MILLING APPARATUS AND HOLDER FOR THE SAME APPARATUS
摘要 <p>PURPOSE:To curtail the time required by transfer of substrate and prevent contact of a part of a processing means within a processing chamber with the atmosphere by providing a means for controlling the interior to vacuum condition within a cassette and also providing sluice valves between respective chambers. CONSTITUTION:A cassette chamber 1, a robot chamber (load lock chamber) 2 and a processing chamber 3 are respectively sluiced by sluice walls 4a, 4b and apertures 5a, 5b formed at the sluice walls 4a, 4b are respectively opened or closed by sluice valves 6a, 6b. Moreover, the cassette chamber 1 is provided with an exhaust means 9 for evacuating the ineterior thereof to the vacuum condition and the robot chamber 2 is provided with a robot 10. Thereby, it no longer required to change the interior of cassette to the atmospheric condition and vacuum condition for each sheet of substrate and the time required for transfer of substrate can be curtailed. In addition, contact with atmosphere of a part of the processing means within the processing chamber can be prevented.</p>
申请公布号 JPH0567588(A) 申请公布日期 1993.03.19
申请号 JP19910227006 申请日期 1991.09.06
申请人 HITACHI LTD 发明人 HASHIMOTO ISAO;OISHI SEITARO
分类号 H01L21/302;H01L21/68;H01L21/683 主分类号 H01L21/302
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