| 摘要 |
<p>PURPOSE:To provide a method of cutting a laminate of silicon and glass, which hardly causes damage to an electronic element formed on a silicon board or insulation failure to a wiring. CONSTITUTION:A method is provided for cutting a laminate 1 obtained by joining a silicon plate 2 and a glass plate 3 having prescribed thickness. The method includes a first process where the silicon plate 2 is cut first with a silicon cutting blade, and a cutting operation is stopped before the silicon cutting blade reaches to the glass 3, and a second process where the uncut silicon 2 and the glass 3 are cut with a glass cutting blade smaller than the silicon cutting blade in width.</p> |
