发明名称 METHOD FOR FORMING MULTILAYER-MICROELECTRONIC- CIRCUIT PACKAGE AND OPTICAL POSITIONING APPARATUS THEREFOR
摘要 PURPOSE: To attain alignment for the formation of lamination, without using a positioning pin and a hole by allowing the surface feature part of a certain layer to match with an optical collimation mark outputted from the surface feature part of a preceding layer and stored. CONSTITUTION: First, a 1st layer 51 is loaded on a carrier board 111 and transferred to an upper vacuum chuck 121. An image-pickup system 203 is controllably moved to the upper part of an overlap feature part 61 to be the physical feature of the layer 51 and focused on the individual feature part 61, and a suitable collimation mark 71 is generated by an optical system 201, allowed to be matched with a selected feature part 61 or arranged at the periphery of the feature part 61 and transferred to a lower vacuum chuck 123. Then, a succeeding layer 53 is taken out and transferred to the chuck 121 and the means 203 is moved again to the upperpart of the layer 53 to pick up the image of the feature part 61. Then the layer 53 is moved controllably and the collimation mark 71 previously generated on the preceding layer 51 is allowed to match with the feature part 61 of the layer 53 or arranged on the periphery of the feature part 61. Consequently, positional accuracy can be enhanced.
申请公布号 JPH0567696(A) 申请公布日期 1993.03.19
申请号 JP19910230459 申请日期 1991.09.10
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 PAAMINDAA SHIN BINDORA;PEETAA YUEGEN RUETSUKU;EEBAAHARUTO HANSU NAAGERE
分类号 H01L21/68;H01L21/00;H01L23/12;H05K1/02;H05K3/46 主分类号 H01L21/68
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