| 摘要 |
PURPOSE:To provide the packaging method of a semiconductor device having high reliability. CONSTITUTION:A semiconductor element chip 11 bonded with a lead frame and bonding wires 14 are coated with a soft and viscous insulating material and dried and sealed temporarily 15 or coated with a liquefied or sprayed insulating material and dried and sealed with a sealing resin material 16. Consequently, the mutual contacts of the bonding wires and the contacts of the bonding wires and an island generated at the time of resin seal can be prevented. The semiconductor element chip and the lead frame, size of which coincide, need not be used, thus decreasing the kinds of the lead frames. Since the small semiconductor element chip can be employed as it is, the breaking of the semiconductor element chip due to breaking stress generated from a sealing resin material can be lowered, thus improving reliability, then reducing a delivery period and cost. |
