发明名称 LEAD ALLOY FOR PLAIN BEARING
摘要 <p>PURPOSE:To obtain an allay having excellent performance that seizing does not occur at the time of high speed running by incorporating a specified amt. of tin into lead contg. specified amounts of indium and copper. CONSTITUTION:This lead allay for a bearing contains, by weight, 2 to <5% Sn, 0.05 to 10% In, 0.05 to 5% Cu and the balance Pb. Sn increases fitness, corrosion resistance, fatigue resistance, wear resistance or the like, but, in the case its content is <2%, the above effects are not shown. Moreover, in the case the content of Sn is >=5%, it diffuses into an Ni plating layer formed, as an intermediate layer, on the surface of kelmet or the like and is made easy to form Ni-Sn compounds. When the above compound layer is made thick, overlaying is made easy to peel. Furthermore, the m.p. of the Pb allay reduces, its melting is made easy to occur and seizing under high speed operation is made easy to occur.</p>
申请公布号 JPH0565568(A) 申请公布日期 1993.03.19
申请号 JP19910254142 申请日期 1991.09.06
申请人 TAIHO KOGYO CO LTD 发明人 OKAMOTO SHINICHI;TOMIKAWA TAKASHI;SUGA SHIGEYUKI
分类号 C22C11/00;C22C11/06;C23C26/02;F16C33/12 主分类号 C22C11/00
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