发明名称 ADHESIVE FOR THIN FILM SECURITY DEVICE
摘要 <p>An ultraviolet (UV) radiation curable pressure sensitive composition which when irradiated with ultraviolet light quickly attains a high tack state for transferring dielectric material thereto, and within hours permanently bonds to the dielectric material to form a thin film security device (TFSD). The UV radiation curable pressure sensitive adhesive comprises: (a) at least one saturated copolyester having terminal acrylic double bonds and hydroxyl moieties; (b) at least one pigment dispersed in a liquid selected from the group consisting of an acrylic monomer, a vinyl ether monomer, oligomers thereof, and blends thereof; (c) at least one vinyl ether monomer, oligomers thereof, or blends of said vinyl ether monomer and oligomers; and (d) at least one photoinitiator in a quantity sufficient to render the composition tacky within about 1 second after exposure to ultraviolet radiation. The invention also provides a method of providing a substrate (and more specifically, banknote paper) with indicia, which comprises: (1) forming a laminate of (a) a polyester film having a thickness of 12-25 microns, (b) a release coating of a thickness of 1-2 microns, (c) a protective layer 1-2 microns thick, and (d) a stack of dielectric and/or metal layers having a maximum thickness of 1 micron; (2) providing a plurality of areas on the substrate, each of which areas bear a UV-curable pressure-sensitive adhesive as described above; (3) subjecting the substrate containing the aforesaid adhesive-bearing areas to UV radiation to cause the areas to become highly tacky; (4) bringing the outer surface of the stack of dielectric and/or metal layers into pressurized contact with the adhesive-bearing areas on the substrate, thereby adhering the laminate to the adhesive-bearing areas on the substrate; and (5) stripping the laminate away from the substrate, whereby the dielectric and/or metal layers are sheared from the release coating and firmly adhere to said adhesive-bearing areas on the substrate.</p>
申请公布号 WO1993005124(A1) 申请公布日期 1993.03.18
申请号 CA1992000110 申请日期 1992.03.16
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