| 摘要 |
<p>This invention is an apparatus for and a process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB) (4), which exhibits significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages (2), and padded semiconductor chips (2) during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane (14), which conformably envelops outlines of the devices and adjacent areas of the PWB. The external application of pressure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this technique and reduces assembly times.</p> |
