| 摘要 |
Trench-shaped depressions (30) are introduced into the injection- moulded substrate (1), which are filled up as far as the surface of the substrate with a metal coating (2) which is preferably deposited in a currentless fashion, and form the printed conductors. Located in the substrate (1), especially the region of plated-through holes (60) are plane depressions (40, 50), in which the metal coating (2) terminates at a distance (A) from the surface of the substrate. This is made possible according to the invention by dimensioning the width (b) of the trench-shaped depressions (30) narrowly and dimensioning the width (B) of the plane depressions (40, 50) so widely that the deposition of the metal coating (2) leads in the trench-shaped depressions (30) to growth and in the plane depressions (40, 50) to a plane metal deposition. A solder resist can then be applied in a plane fashion without photostructuring, for example by roller coating, without penetrating into the plane depressions (40, 50). A tin layer (3) is then applied, for example by means of hot tinning, for the purpose of forming the desired soldering eyelets or terminal faces. …<IMAGE>… |
