| 发明名称 |
SUBSTRATE FOR A PRINTED CIRCUIT BOARD |
| 摘要 |
<p>A substrate for a printed circuit board, comprising a metal core plate having apertures and an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, coated thereon, wherein said apertures are filled with a mixture of said resin and an inorganic filler.</p> |
| 申请公布号 |
EP0244699(B1) |
申请公布日期 |
1993.03.17 |
| 申请号 |
EP19870105901 |
申请日期 |
1987.04.22 |
| 申请人 |
MITSUBISHI PLASTICS INDUSTRIES LIMITED |
发明人 |
NAGAMATSU, HIROSHI MITSUBISHI PLASTICS;IWASAKI, KANAME MITSUBISHI PLASTICS |
| 分类号 |
B32B15/08;B32B17/04;H05K1/03;H05K1/05;H05K3/44;H05K3/46;H05K9/00 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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