Thin film multilayer structure for barrier treatments on plastic film

摘要

A multilayer structure of thin dielectric and/or metallic films is useful for barrier coating treatment of plastics film. The structure comprises layers of SiO2 and Al2O3 or SiO and Al2O3. Alternatively a layer of mixture of SiO2 and Al2O3 may be used. The structure may be utilised for packaging, and above all for food packaging applications and in other fields where high barrier performance against gas and/or vapours is required. A combination of thermal evaporation and PECVD may be employed for deposition of the layers.