| 摘要 |
This invention relates to an automatic loading mechanism for PC board electroplating and in particular to one utilizing a program controlling device to activate pneumatic cylinders (22) to open a clamp (21) and move a supporting frame together with a fly bar (7) and clamping devices downwards until the PC boards (6) are guided by bell-shaped entrance of guiding devices and cover the sensor, then withdraw the pneumatic cylinders causing the clamps to grip the PC boards and raise the supporting frame to its original position thereby achieving the purpose of automatic loading. <IMAGE> <IMAGE>
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