Semiconductor wafer polishing using a hydrostatic medium

摘要

A method and apparatus for polishing semiconductor wafers in which a force applied to the wafer is uniformly distributed across a surface of the wafer during polishing using a hydrostatic or compliant material situated between the wafer and a piston. In a preferred embodiment, the hydrostatic or compliant material is an elastic solid or fluid filled bag. One or more teflon disks or teflon coated surfaces may be included between the hydrostatic or compliant material and a second compliant layer to form a bearing to allow the wafer to rotate about its central axis during polishing.