| 摘要 |
<p>PURPOSE:To facilitate positioning at the time of laminating chips while allowing lamination of a number of chips in relation to a semiconductor device in which a plurality of discrete elements are mounted. CONSTITUTION:An semiconductor device is so composed that a plurality of semiconductor chips 2 are laminated and the chips 2 have electrodes to be connected through the through holes 12, 22 going through the chips on the suface and the rear thereof so as to perform mutual connection of chips 2 by the electrodes.</p> |
