| 摘要 |
PURPOSE:To make a wire difficult to cut off after bonding in the wire-bonding method of an infrared detector. CONSTITUTION:The title method is the wire-bonding method of the inner cylinder side wiring pattern 10 and terminal board side wiring pattern 14 of an infrared detector equipped with an inner cylinder 6, infrared detection element 8, inner cylinder side wiring pattern 10, terminal board 16 and terminal board side wiring pattern 14. Further, the method comprises a step for supporting the inner cylinder 6 horizontally to bond the starting point of a bonding wire to the inner cylinder side wiring pattern, a step for rotating the inner cylinder 6 by 90 to move the capillary 26 of a bonding apparatus in the direction of going away from the inner cylinder and a step for moving the capillary again in the direction of coming near the inner cylinder to bond the end of the bonding wire to the terminal board side wiring pattern 14. |
