| 摘要 |
Capacitive substrate for an integrated circuit, comprising at least one planar decoupling capacitor (100) of given surface area, the said substrate being intended to accommodate an integrated circuit (200) in a mounting region (110) defined on a first face (120) of the said decoupling capacitor. According to the invention, the said mounting region (110) being situated within the surface area of the decoupling capacitor, the said capacitive substrate has, on the said first face (120), outside the mounting region (110), a plurality of connection terminals (300, 301, 302) including at least two output terminals (301, 302) of the said capacitor, and intended to be linked to the said integrated circuit (200). Application to the production of electronic assemblies using integrated circuits. <IMAGE>
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