发明名称 |
FEUILLE ADHESIVE UTILISABLE NOTAMMENT POUR LE DECOUPAGE DE PASTILLES SEMICONDUCTRICES SOUS LA FORME DE MICROPLAQUETTES |
摘要 |
An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up. |
申请公布号 |
FR2592390(B1) |
申请公布日期 |
1993.03.12 |
申请号 |
FR19860018037 |
申请日期 |
1986.12.23 |
申请人 |
FSK KK |
发明人 |
KAZUYOSHI EBE, HIROAKI NARITA, KATSUHISA TAGUCHI, YOSHITAKA AKEDA ET TAKANORI SAITO;NARITA HIROAKI;TAGUCHI KATSUHISA;AKEDA YOSHITAKA;SAITO TAKANORI |
分类号 |
C09J4/06;C09J7/02;C09J175/16;H01L21/00;H01L21/302;H01L21/68;(IPC1-7):C09J7/02 |
主分类号 |
C09J4/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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