| 摘要 |
<p>PURPOSE:To protect a semiconductor wafer against an external pressure when an adhesive tape is adhered to the rear surface of the wafer in a dicing step. CONSTITUTION:A wafer W is sent between a wafer adhering roller 11 and a pressing roller 12 without peeling a protective adhesive tape 2 adhered to the front surface of the wafer W and pressed from above to adhere an adhesive tape 15 to the rear surface of the wafer W in a back grinding step of a previous step of a dicing step. The mechanical strength of the wafer W is increased by the tape 2, and the wafer W is protected against the energizing force of the roller 12. A circuit pattern formed on the front surface of the wafer W is not brought into direct contact with the roller 12, and damage, contamination of the pattern are also prevented.</p> |
