| 摘要 |
PURPOSE:To prevent shortcircuit of the semiconductor device by so forming sealing material on the surface to be adhered onto the wall of a semiconductor container as not to produce accumulations in the four corners of a pattern. CONSTITUTION:The pattern of sealing material 6 formed on a wall 4 is formed in an arc 13 without an angle. Accordingly, no accumulation of sealing material is produced, and there can be prevented shortcircuit between bonded wires due to accumulation, and shortcircuit of wires built in the device due to the spattered accumulation of the material. |
