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发明名称
FORMING METHOD OF RECESSED PART FOR MOUNTING ELECTRONIC PARTS ON PRINTED WIRING BOARD
摘要
申请公布号
JPH0563339(A)
申请公布日期
1993.03.12
申请号
JP19910221888
申请日期
1991.09.02
申请人
IBIDEN CO LTD
发明人
NISHIKAWA YOSHIYASU
分类号
H05K3/18;H05K3/38
主分类号
H05K3/18
代理机构
代理人
主权项
地址
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