| 摘要 |
PURPOSE:To contrive the reduction in weight of a module. CONSTITUTION:A conductive paste 7 having the characteristic of 15 to 30kg/mm<2> elastic modulus, 3 to 10%, ductility 7X10<-3> to 15X10<-3>cal/cm.sec. deg.C coefficient of thermal conductivity 1.0X10<-4> to 3.0X10<-4>OMEGAcm specific heat resistance, and 77 to 83% content ratio of before-fastening metallic power is used for the fixing of a microwave semiconductor element 5 to a package 4 and the fixing of a microwave dielectric circuit substrate 3 to a module case 1. Therefore, the conductive paste absorbs the thermal stress so that the Al can be used as a case material of the microwave module, resulting in making the module light in weight. |
