| 摘要 |
PURPOSE:To obtain an apparatus in which the positional deviation of a wafer due to elongation/contraction of the wafer owing to manufacturing steps and a magnification calculating accuracy is improved by providing special environment measuring means, position correcting means, projection magnification correcting means, integral exposure dose detecting means positional deviation detecting means and elongation/ contraction ratio calculating means. CONSTITUTION:The exposure apparatus comprises environment measuring means 15 for measuring atmospheric temperature, moisture and pressure near stages 12, 3, position correcting means 17 for correcting a stage measured position by interferometers 13, 14 from physical amounts regarding an environment, and projection magnification correcting means 18 for correcting the projection magnification of a projection optical system l from change in the atmospheric pressure. Further, the apparatus also comprises integrated exposure dose detecting means 20 for measuring an exposure optical mount to irradiate from an exposure illumination light source 2 and calculating a change in projection magnification of the system 1 from the integrated exposure amount, projection magnification correcting means 11 for correcting the projection magnification of the system 1 from the change in the magnification, detecting means 8 for detecting a positional deviation, and means 10 for obtaining elongation/contraction ratio of a wafer W. |
