| 摘要 |
PURPOSE:To reduce generation of defective units caused by ooze and sag of dielectric paste and residue of developing solution which are generated at the contact via part of a multilayered printed wiring board. CONSTITUTION:A lower layer pattern 2 is formed on a board 1 by a photolithography method. Conductor paste 3 having hydrophobic nature is spread on the connection part of the lower layer pattern 2 to an upper layer pattern 5 by a screen printing method. Thus the thick film of a contact via is formed. Hydrophilic dielectric paste 4 is spread on the lower layer pattern except the board and the contact via part by a screen printing method. Thus the thick film of an insulative layer is formed. An upper layer patter is formed on the contact via of the conductor paste 3 and the insulative layer of the dielectric paste 4 by photolithography method. |
