| 摘要 |
PURPOSE:To provide an IC package, in which there is no possibility, in which a connecting section with a circuit board is deformed and flashing is generated, and which can be thinned and a mounting area of which can be reduced, because there is trouble, in which deformation is easy to be generated because an outer lead is used as the connecting section, defective connection is easy to be generated, the adhesion of a flash at the time of molding is not avoided and thinning and the decrease of the mounting area are difficult, in a conventional mold type IC package. CONSTITUTION:A contact hole 6 communicating with the top face or rear of a package from an inner lead 4 is formed into package, and the contact hole 6 is filled with a conductive material such as solder, copper, etc., thus forming a contact 7 section for external connection. |
