| 摘要 |
PURPOSE:To provide a junction method between a semiconductor device and a board which is capable of bonding and joining the semiconductor device with the board with efficiency in a short time equivalent to the time required for a junction method which bonds the semiconductor device with the board by means of an isotropic conductive agent and connecting continuously the semiconductor device with the board definitely without producing any faulty continuity and, what is more, reducing production cost more than a junction method which uses the isotropic conductive agent. CONSTITUTION:There is interposed an ultraviolet-curing type or hot metal type insulating boding agent 6 between a plurality of terminals 2 formed on a semiconductor device 1 and a plurality of connection terminals 5a formed on a board 4. The semiconductor device 1 and the board 4 are relatively depressed with pressure ranging from 5 to 30g applied to each of the terminals 2 and 5a. Ultraviolet rays are emitted to the insulating bonding agent 6 under the pressure loading condition or the insulating bonding agent 6 is hardened by heating and cooling.
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