| 摘要 |
An apparatus and a method for electroless copper plating of complex plastic microwave assemblies (20) are disclosed. A rigid panel has openings (12) adapted to secure microwave assemblies (20) therein. The panel (11) has a size relative to an electroless copper plating tank (45) that causes sufficient plating solution (46) flow through channels disposed in the microwave assemblies (20) by minimizing solution flow bypassing of the channels. This achieves complete copper plating of the inner surfaces in the channels. A relatively large panel builds up back pressure as it approaches plating tank walls, which creates a pressure differential as it moves through the plating tank (45), thus forcing solution (46) through the channels. The flow-inducing panels (11) easily hold many assemblies (20) in a stabalized manner which yields high productivity, and provide solution flow through the channels using a standard metallization basket used for printing wiring board manufacturing. <IMAGE> |
