Electric circuit board module and method for producing electric circuit board module.

摘要

An electric circuit board module (CB) includes a substrate (11) with electric components (37) mounted on one side thereof and electrodes (12) provided on the other side thereof for the electric connection with the mounted electrical components (37). The electric circuit board module (CB) further includes conductor columns (13) adhered to the electrodes (12) and an adhesion layer (12) provided on the other side of the substrate (11) and around the conductor columns (13) such that the conductor columns (13) extrude from the adhesion layer (14) by a predetermined length. By pressing the electric circuit board module (CB) against a separate circuit board (PB) to mount thereon, the electric components (37) are electrically connected with electrodes of the sperate circuit board (PB) through conductor columns (13). Since conductor columns (13) are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.