Photosensitive polyimide precursor compositions and process for preparing same.

摘要

A photosensitive polyimide precursor composition comprises a poly(amic acid) wherein at least one molecular end is esterified with an alcohol, a compound containing carbon-carbon unsaturation having photoreactivity, and a photopolymerization initiator. Film formed from this composition can be masked for patterning and then subjected to exposure and development using a developer, the amount of exposed portion dissolved in the developer being particularly small so that it is possible to obtain a thick pattern. Subsequent heat-treating this pattern provides a thick polyimide pattern.