| 摘要 |
A semiconductor chip for mounting on a package substrate by a flip-chip process. The semiconductor chip comprises a plurality of electrode pads (22) of a first group provided on a major surface (21a) of the semiconductor chip for external electrical connection such that the electrode pads of the first group covers a major surface of the semiconductor chips in rows and columns; and a plurality of electrode pads (23) of a second group each having size substantially larger than the electrode pads of the first group and provided on the major surface of said semiconductor chip in electrical connection with an active part of the semiconductor chip that is used for a burn-in process; wherein each of the electrode pads (22) of the first group is covered by a solder bump (22) that projects from the major surface of said semiconductor chip with a first distance (H); and wherein each of the electrode pads (23) of the second group is formed of a conductor material having a melting point higher than the solder bump and projecting from the major surface of the semiconductor chip with a second distance (h) that is substantially smaller than the first distance. <IMAGE> |
