| 发明名称 |
LEAD FRAME FOR A SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A lead frame (10) for a semiconductor device comprising: a lead frame material made of a metal strip (20) and including at least a plurality of inner (14) and outer (12) leads, a Pd or Pd-alloy film (24) formed directly or via an underlayer film (26) on an entire surface of the lead frame material; and an Ag- or Au-plated film (28) further formed on the Pd or Pd-alloy film (24) of at least said outer leads (12) of the lead frame material. <IMAGE></p> |
| 申请公布号 |
EP0474499(A3) |
申请公布日期 |
1993.03.10 |
| 申请号 |
EP19910308157 |
申请日期 |
1991.09.05 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
WAKABAYASHI, NORIO;MURATA, AKIHIKO |
| 分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
