Etching rate determining method and apparatus.

摘要

The etching ability of an etchant for a metal part is monitored by accurately measuring the etching rate with a relatively simple arrangement. The etching rate is determined by channelling a portion of the etchant from an etching tank (4) to a reaction chamber (1), etching a specimen (8) of the same material as a metal part with the etchant portion in the reaction chamber (1), collecting hydrogen gas generated during etching of the specimen, measuring the time taken until a predetermined quantity of hydrogen gas is generated, and computing the etching rate from the measured time. <IMAGE>