发明名称 Method for manufacturing semiconductor stacked CMOS devices
摘要 A semiconductor stacked CMOS device in which gate electrodes are laid on the upper and lower sides of an upper MOS FET, and a gate oxide film of the upper MOS FET is formed by oxidizing polycrystalline Si film having a low impurity concentration, wherey the current drive capability and the insulative proof-voltage can be enhanced. Further, the polycrystalline Si is formed on a silicon nitride film or a silicon oxide film having a less surface roughness, and accordingly, the lower surface of the polycrystalline Si has also a less surface roughness, whereby it is possible to further enhance the insulative proof-voltage.
申请公布号 US5192705(A) 申请公布日期 1993.03.09
申请号 US19910711149 申请日期 1991.06.06
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 ITOH, MASAHIRO
分类号 H01L29/78;H01L21/822;H01L21/8238;H01L27/06;H01L27/092;H01L29/786 主分类号 H01L29/78
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