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发明名称
RESIN COMPOSITION FOR THERMAL SEALING OF GLASS, ETC., AND LID MATERIAL FOR THERMAL SEALING
摘要
申请公布号
JPH0559230(A)
申请公布日期
1993.03.09
申请号
JP19910242772
申请日期
1991.08.28
申请人
SHOWA ALUM CORP
发明人
TAKADA SUSUMU;KAWAI HIDEO
分类号
C08K5/12;C08K5/10;C08L23/08;C08L31/04;C09K3/10
主分类号
C08K5/12
代理机构
代理人
主权项
地址
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