发明名称 POLYAMIDE RESIN FILM
摘要 PURPOSE:To obtain a polyamide resin film excelling in transparency, slip and printability and difficultly undergoing surface defects such as die lines. CONSTITUTION:A polyamide resin film prepared by molding a resin composition prepared by mixing 100 pts.wt. polyamide resin with 0.01-1 pt.wt. bisamide compound (ethylene-bisstearamide), 0.01-1 pt.wt. partial ester compound (monoglyceride) of a tri- to hexa-hydric aliphatic alcohol with a 10-22C fatty acid and 0.01-0.5 pt.wt. inorganic filler particles (silica).
申请公布号 JPH0559274(A) 申请公布日期 1993.03.09
申请号 JP19910217498 申请日期 1991.08.28
申请人 MITSUBISHI KASEI CORP 发明人 MURAKAMI YUKINORI;NAKAJIMA TAKASHI;KAMOSHITA HIDEKAZU;KANEMASA TOMOAKI
分类号 C08J5/18;C08K3/00;C08K3/34;C08K5/107;C08K5/11;C08K5/20;C08L77/00 主分类号 C08J5/18
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