| 摘要 |
<p>PURPOSE:To prevent direct contact between an ejector pin and a heat sink using a molded die for packages while keeping a sufficient size of a heat sink for the size of a molded object, by providing a means for preventing direct interference between the heat sink and ejector pin. CONSTITUTION:A heat sink 2 is formed in such a manner as it is buried within a resin material. A cutout part 5 is provided to the angular part of the heat sink avoiding the trace of ejector pin 3 with a constant interval. An IC chip 6 is fixed to the single surface of the heat sink. On the occasion of separating a package 1 molded within a metal die by operating an ejector pin 7 of an upper die 8, the front end of ejector pin 7 is a little protruded from the internal surface of the upper die 8, but the pin 7 does not come in contact with the exposed surface of the heat sink and the external size of heat sink is maximized to keep heat radiating characteristic. Therefore, the conventional metal dies can be used in common without any modification.</p> |
