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发明名称
MANUFACTURE OF ELECTRONIC COMPONENT HOUSING PACKAGE
摘要
申请公布号
JPH0555395(A)
申请公布日期
1993.03.05
申请号
JP19910218705
申请日期
1991.08.29
申请人
KYOCERA CORP
发明人
TAKEHASHI NOBUYUKI
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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