发明名称 ELECTRONIC PART DEVICE
摘要 PURPOSE:To conduct high density mounting even when an element, on which an active layer is not coated with resin, is used by a method wherein the flowing in of resin to the active surface of an elastic surface wave generating element is prevented by providing a dam on the circumference of the functional part of the title device. CONSTITUTION:Dams 3, made of polyimide resin and the like, are provided surrounding an elastic surface wave element 5 for the purpose of preventing the resin 71 from flowing away before hardening. Besides, the interdigital electrode of the elastic surface wave element 5 is prevented from being covered by the resin 7 with which the element is covered entirely. As a result, the interdigital electrode pattern 5a of the elastic surface wave element 5 and the wiring substrate 1 are facing each other, and dams 9 made of polyimide resin are provided on the wiring substrate 1 on the circumferential part in the cavity part 8 formed by bumps 6. The resin is prevented from flowing into the cavity part 8 before it is hardened by the above-mentioned dams.
申请公布号 JPH0555303(A) 申请公布日期 1993.03.05
申请号 JP19910218437 申请日期 1991.08.29
申请人 TOSHIBA CORP 发明人 MISHIMA NAOYUKI
分类号 H01L21/60;H01L23/28;H03H9/02;H03H9/25 主分类号 H01L21/60
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