| 摘要 |
PURPOSE:To provide a circuit board on which a large heat generating semiconductor element can be mounted and to which wiring conductors and circuit conductors can be stuck with a good adhesive property with excellent electrical conduction maintained between the conductors. CONSTITUTION:This circuit board is constituted by sticking circuit conductors 4 made of copper to the external surface of an insulating substrate 1 composed of an aluminum nitride sintered body and provided with wiring conductors 2 made of at least one selected out of tungsten and molybdenum so that part of the conductors 4 can be brought into contact with the conductors 2. An intermediate metallic layer 3 made of an alloy of at least one selected out of nickel and cobalt and at least one selected out of tungsten and molybdenum is provided at contact sections between the conductors 2 and 4 and, at the same time, oxide films 5 are formed on the substrate 1 at parts where at least the conductors are stuck to the substrate 1. Since the substrate 1 has a high coefficient of thermal conductivity, a semiconductor element which generates a large amount of heat can be mounted on the substrate 1. |
