发明名称 ROLL SOLDER COATING DEVICE
摘要 PURPOSE:To simultaneously coat both sides with solder while horizontally feeding a lead frame by forming a package passage groove larger than a package, and increasing a gap between a coating block and a coating roll. CONSTITUTION:A package is formed in a sufficiently large size at package passage grooves 43, 45 so as not to be brought into contact with melted solder 32. A lower surface of a lead frame 1 is coated with the solder 32 adhered to the surface of a coating roll 37 and raised. Excess melted solder 32 is fed upward from a hole formed at the gap between a lead and a lead, retained in a gap to a coating block 44 to coat the upper surface of the frame 1. Accordingly, the frame can be simultaneously coated on both side surfaces while horizontally moving the frame.
申请公布号 JPH0555428(A) 申请公布日期 1993.03.05
申请号 JP19910181670 申请日期 1991.06.27
申请人 FUJI SEIKI MACH WORKS LTD 发明人 KOJIMA NAOKATSU;SAKAKI KAZUHIKO
分类号 B05C1/02;B23K1/08;B23K101/40;H01L23/50 主分类号 B05C1/02
代理机构 代理人
主权项
地址