发明名称 |
ROLL SOLDER COATING DEVICE |
摘要 |
PURPOSE:To simultaneously coat both sides with solder while horizontally feeding a lead frame by forming a package passage groove larger than a package, and increasing a gap between a coating block and a coating roll. CONSTITUTION:A package is formed in a sufficiently large size at package passage grooves 43, 45 so as not to be brought into contact with melted solder 32. A lower surface of a lead frame 1 is coated with the solder 32 adhered to the surface of a coating roll 37 and raised. Excess melted solder 32 is fed upward from a hole formed at the gap between a lead and a lead, retained in a gap to a coating block 44 to coat the upper surface of the frame 1. Accordingly, the frame can be simultaneously coated on both side surfaces while horizontally moving the frame. |
申请公布号 |
JPH0555428(A) |
申请公布日期 |
1993.03.05 |
申请号 |
JP19910181670 |
申请日期 |
1991.06.27 |
申请人 |
FUJI SEIKI MACH WORKS LTD |
发明人 |
KOJIMA NAOKATSU;SAKAKI KAZUHIKO |
分类号 |
B05C1/02;B23K1/08;B23K101/40;H01L23/50 |
主分类号 |
B05C1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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